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MEMS Foundry Services

Work with the best

Sensonor Foundry Services - your access to decades of experience

Sensonor operates a 150 mm MEMS production facility that has been in continuous operation since 1985. The fab holds extensive industrial experience in production of safety critical devices to the automotive, defense, aerospace, and medical industry. Today the fab supplies MEMS devices for Sensonor Gyro and IMU products in addition to foundry production for several global customers. Sensonor holds a unique competence from the development of MEMS structures for its own products when it comes to planning for robust processes, traceability and process repeatability . These assets we carry into any design for any customer. A foundry production runs in the same production processes developed and used for our own products. Sensonor has a stable production staff with individuals that holds several decades of MEMS production experience and that takes great pride in its craftsmanship.

Long-term commitment. We know that the process from a MEMS design until a commercial product takes time, often a very long time. Sensonor is committed to support foundry customers in this process, and we have designs supported for almost two decades.

Sensonor holds special competence in piezoresistive and capacitive designs with extensive experience of pressure sensors with long-term stability and reliability. Sensonor operates a fully equipped production line including (ion) implantation and furnace processing, metal sputtering, dry and wet etching, glass processing, anodic bonding, dicing, testing and inspection.

Please contact Foundryservices@sensonor.com for more information or if you have a design that you would like to discuss with our engineers.

Standard Processes

Technologies:

  • Bulk micromachining of MEMS structures
  • Precise silicon membrane thickness control by electrochemical etch-stop. Alternative to expensive SOI-designs
  • Triple-stack anodic wafer bonding with vacuum or controlled cavity pressures
  • Press contacts for electrical crossings between bonded wafers
  • Buried conductor crossings of bonded areas and silicon-to-glass press contacts
  • Piezo resistive detection, including high sensitivity surface resistors or long term stability buried resistors
  • Capacitive detection with electrodes on glass

Silicon wafer processing:

  • Laser marking
  • Photolithography (spin/align/develop/strip) including backside patterning and front-to-backside alignment
  • Furnaces for wet and dry thermal oxidation, diffusion and sintering
  • Ion implantation (B, P, As)
  • Metal sputtering (Al, AlSi) and wet etch
  • Silicon dry etch
  • Silicon wet etch (TMAH) with electrochemical etch-stop
  • In-line characterization incl profilometry, ellipsometry, sheet resistance, FTIR, CD-measurements

Glass wafer processing:

  • Micromachining by wet etch
  • Photolithography (spin- and spray coating) including backside patterning and front-to-backside alignment
  • Metal sputtering (Ti, TiN, Al) and wet etch
  • Anti stiction coating

Anodic bonding:

Double- and triple stack bonding

Test and inspection:

  • In-line and end-line electrical wafer level test
  • In-line and end-line automated visual inspection
  • Optical and electron microscopy

Dicing and packaging:

  • Dicing of triple-stack wafers
  • Wafer level packing or automated waffle pack


    Please contact Foundryservices@sensonor.com for more information

Manufacturing capabilities

150 - 200 wafer starts per week (8 to 20 layers)

2400 m2 cleanroom facility