Thermal Imaging

Sensonor will offer non-cooled and TEC (Thermo-Electric-Cooler) less bolometer focal plane arrays (FPA's) for High Precision applications. The solution is based on a unique Si/SiGe mono-crystalline quantum well structure used as the temperature-sensing (thermistor) membrane of the pixels. The TCR (temperature coefficient of resistance) of this material surpasses today's available technologies and at the same time the mono-crystalline grain boundary free material secures superior 1/f noise performance. This novel pixel technology is coupled with Sensonor's wafer bonding experience to offer the combination of the best signal-noise ratio and the best reliability at the lowest cost.

Sensonor has a close cooperation with Acreo to optimize the bolometer technology and both parties are as well involved in common EU funded programs aiming to bring this innovative solution into industry.

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Homepage of our partner Acreo AB and the IMAGIC R&D Center presented in Aperturen 2/2006:
www.acreo.com and Aperturen 2006-2

PIMS (Pedestrian Injury Mitigation System):
www.autoliv.com

FNIR (Fusing Far and Near Infra Red imaging for pedestrian injury mitigation):
www.fnir.nu

ICU (Infrared Imaging Components for Use in Automotive Safety Applications):
www.icu-eu.com