Thermal Imaging

Sensonor will offer non-cooled and TEC (Thermo-Electric-Cooler) less bolometer focal plane arrays (FPA's) for High Precision applications. The solution is based on a unique Si/SiGe mono-crystalline quantum well structure used as the temperature-sensing (thermistor) membrane of the pixels. The TCR (temperature coefficient of resistance) of this material surpasses today's available technologies and at the same time the mono-crystalline grain boundary free material secures superior 1/f noise performance. This novel pixel technology is coupled with Sensonor's wafer bonding experience to offer the combination of the best signal-noise ratio and the best reliability at the lowest cost.

Sensonor has a close cooperation with Acreo to optimize the bolometer technology and both parties are as well involved in common EU funded programs aiming to bring this innovative solution into industry.

For more information:

• Homepage of our partner Acreo AB and the IMAGIC R&D Center presented in Aperturen 2/2006:
  www.acreo.com and Aperturen 2006-2
• PIMS (Pedestrian Injury Mitigation System):
  www.autoliv.com
• FNIR (Fusing Far and Near Infra Red imaging for pedestrian injury mitigation):
  www.fnir.nu
• ICU (Infrared Imaging Components for Use in Automotive Safety Applications):
  www.icu-eu.com