A range of small and robust absolute pressure sensors are
offered. The whole product range utilizes Sensonor's patented
anodic wafer bonding technology with electrical crossings buried
under an epitaxial layer. The bulk micromachined triple stack
solution results in excellent media compatibility. Piezoresistors
are buried inside the pressure diaphragm on opposite side of media
access and will therefore never be in contact with measurement
media. This design makes the sensors robust in harsh environment
applications, with superior stability and performance over long
lifetime compared to most traditional MEMS sensor designs.