Sensonor offer a range of small and robust absolute pressure
sensor dies. The product range utilizes Sensonor's patented anodic
wafer bonding technology with electrical crossings buried under an
epitaxial layer. The bulk micromachined triple stack solution
results in excellent media compatibility. Piezoresistors are buried
inside the pressure diaphragm on opposite side of media access and
will therefore never be in contact with measurement media. This
design makes the sensors robust in harsh environment applications,
with superior stability and performance over long lifetime compared
to many traditional MEMS sensor designs.