Sensonor offer a range of small and robust absolute pressure
sensor dies. The product range utilizes Sensonor's anodic wafer
bonding technology with electrical crossings buried under an
epitaxial layer. This guarantees unbeaten performance for demanding
applications requiring high life time stability and high media
compatibility. The reliability is proven with less than 0.1ppm
failure rate for more than 200 million sensors shipped for
automotive and industrial applications.
The sensor dies are offered in wafer packs, as single wafers and
wafer lots. Sensonor pressure dies are ideal building blocks for
OEM customer. The SW412 sensor die includes an on-chip
accelerometer.