A range of small and robust absolute pressure sensors are
offered. The whole product range utilizes Sensonor's anodic wafer
bonding technology with electrical crossings buried under an
epitaxial layer. This guarantees unbeaten performance for demanding
applications requiring high life time stability and good media
compatibility. Less than 0.1ppm failure rate for several 100
million sensors shipped for automotive applications is our
proof.
The sensors are offered as dies in tray packs, as single wafers
and wafer lots, in non-compensated SOIC packaged versions and in
fully compensated SOIC packaged digital versions. This will give
our customers the choice to integrate this unique technology at the
right level in the value chain.
The SP300 range brings the art of pressure sensing to a new
dimension. The sensor contains an embedded microcontroller that can
be used to run application specific programs. Additionally and
complementary an LF wireless actuation interface is included
capable for configuration and functional commands. This unique
combination of embedded microcontroller and LF-input makes the
sensor capable as a platform for standalone system operation in
remote and inaccessible locations.
An on-chip integrated (115g range) accelerometer is available
for all Sensonor's pressure sensor classes. Only your imagination
will determine the use of this unique feature. A typical
application is for wake-up in battery powered systems reacting on
movement, vibrations or shock.